Ravinder Dahiya is Professor of Electronics and Nanoengineering and EPSRC Research Fellow in the James Watt School of Engineering at University of Glasgow. His group (Bendable Electronics and Sensing Technologies (BEST) research group) conducts fundamental research in flexible printed electronics, electronic skin, and their application in robotics, prosthetics, and wearables. Prof. Dahiya has published more than 350 research articles, 7 books, and 15 submitted/granted patents. He has given more than 150 invited/plenary talks. He has led and contributed to many international projects.

Prof. Dahiya is President-Elect of IEEE Sensors Council. He is also the Distinguished Lecturer of IEEE Sensors Council and is serving on the Editorial Boards of several leading journals Prof. Dahiya holds EPSRC Fellowship and received Marie Curie Fellowship and Japanese Monbusho Fellowship in past. He has received several awards, including 9 best journal/conference paper awards as author/co-author. Prof. Dahiya is Fellow of IEEE.


Soft Electronic Skin


The miniaturization led advances in electronics over last half a century have revolutionized computing and communication. Recent advances in the field are propelled by applications such as conformable electronic skin that require electronics, sensors, and actuators embedded in soft and squishy materials. These requirements call for new methods to realize distributed sensing, actuation, and computing on unconventional substrates such as plastic, paper and elastomers. This talk will present some of these approaches, which range from distributed off-the-shelf devices embedded in soft materials or integrated on flexible printed circuit boards, to using printed nanowires, graphene, and ultra-thin chips, etc. and lead to development of large area tactile or electronic skin The technology behind such sensitive flexible and squishy electronic systems is also the key enabler for advances in emerging fields such as robotics, wearables, and healthcare technologies etc. This lecture will briefly discuss these advances and the future directions.


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